Evaporation source
US10676812B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Aug 17, 2016 |
| Grant date | Jun 9, 2020 |
| Priority date | — |
| Expiry date | Jul 1, 2037 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C14/562
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Embodiments of the disclosure generally relate to evaporation sources used for physical vapor deposition of material onto substrates and more particularly for controlled coating of large substrates, such as vacuum deposition of selenium on flexible substrates. In one embodiment an evaporation source for depositing a source material on a substrate is provided. The evaporation source includes a crucible having a base and a first plurality of walls surrounding an interior region of the crucible. The crucible further includes a supporting ridge extending inwardly towards the interior region. The evaporation source further includes a lid disposed on the supporting ridge, the lid including two or more adjacently positioned sheets, where each sheet includes a plurality of openings formed therethrough, and the plurality of openings in each sheet are not aligned with the plurality of openings formed in an adjacently positioned sheet.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.