Horizontal fracture prediction method, device and equipment
US10677947B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 9, 2019 |
| Grant date | Jun 9, 2020 |
| Priority date | — |
| Expiry date | Aug 9, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01V2210/646
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The present disclosure provides a horizontal fracture prediction method, device and equipment. The method comprises: acquiring primary wave velocities and shear wave velocities of first and second incidence angle directions of seismic waves at a target fracture location, wherein a first incidence angle is smaller than a second incidence angle, and the incidence angles are included angles between propagation directions of the seismic waves and a surface normal direction of a target fracture; calculating a first primary wave/shear wave velocity ratio and a first shear wave splitting (SWS) coefficient of the first incidence angle direction; calculating a second primary wave/shear wave velocity ratio of the second incidence angle direction; and determining that the target fracture is a horizontal fracture under the condition that the first SWS coefficient is smaller than a first preset value and a ratio of the first primary wave/shear wave velocity ratio to the second primary wave/shear wave velocity ratio is smaller than a second preset value. According to embodiments of the present disclosure, whether the target fracture is the horizontal fracture or not is determined through calcula…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.