Lens wafer assembly and associated method for manufacturing a stepped spacer wafer
US10677964B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 23, 2017 |
| Grant date | Jun 9, 2020 |
| Priority date | — |
| Expiry date | Jun 23, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B13/0085
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method for manufacturing a stepped spacer wafer for a wafer-level camera includes a step of measuring a plurality of focal lengths f1,2, . . . , N of a respective one of a plurality of lenses L1,2, . . . , N of a lens wafer. The method also includes a step of fabricating a stepped spacer wafer including (i) a plurality of apertures A1,2, . . . , N therethrough, and (ii) a plurality of thicknesses T1,2, . . . , N defining a respective thickness of the stepped spacer wafer at least partially surrounding a respective one of the plurality of apertures A1,2, . . . , N. Each of the plurality of thicknesses T1,2, . . . , N is equal to a difference between (a) a respective one of the plurality of focal lengths f1,2, . . . , N, and (b) a uniform thickness that is the same for each of the plurality of thicknesses.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.