Mobile terminal and fingerprint module thereof
US10679035B2 · kind B2 · utility
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0References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 12, 2019 |
| Grant date | Jun 9, 2020 |
| Priority date | — |
| Expiry date | Jun 12, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04M1/026
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A fingerprint module and a mobile terminal are described. The fingerprint module may include: an encapsulation layer and a decoration component. The encapsulation layer may be configured to encapsulate a fingerprint identifying assembly and include a rear wall having a first mating portion. The decoration component may define an embedded groove and include a second mating portion in the embedded groove. The encapsulation layer may be embedded in the embedded groove, and the first mating portion may be embedded to the second mating portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.