Printed circuit board
US10679766B2 · kind B2 · utility
0Cited by
2References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 19, 2018 |
| Grant date | Jun 9, 2020 |
| Priority date | — |
| Expiry date | Mar 19, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10977
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board has a printed wiring board and a semiconductor package mounted on the printed wiring board. The printed wiring board and the semiconductor package are connected with a plurality of solder balls. An underfill material covering the plurality of solder balls is filled between the printed wiring board and the semiconductor package. The underfill material has a relative dielectric constant of 8.6 or more and 54.4 or less. Thus, crosstalk noise generated in wiring in the out-of-plane direction is reduced without increasing the mounting area.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.