Method for electronics manufacturing using direct write with fabricated foils
US10681813B2 · kind B2 · utility
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5Claims
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Key dates
| Filing date | Jul 5, 2018 |
| Grant date | Jun 9, 2020 |
| Priority date | — |
| Expiry date | Jul 5, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0355
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Method for manufacturing an electronic component is provided. The method includes manufacturing elements that are produced by an additive manufacturing process. Moreover, the elements are produced in the same plane or out of plain with one or more foil substrates. The elements may be various structures, including, for example, connectors, electrical components (e.g., a resistor, a capacitor, a switch, and/or the like), and/or any other suitable electrical elements and/or structures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.