High-density universally-configurable system board architecture with dual-use modular mid-board optics (MBOs)
US10681832B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 6, 2019 |
| Grant date | Jun 9, 2020 |
| Priority date | — |
| Expiry date | Jun 6, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10734
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A high-density universally-configurable system board architecture for use with multiple mid-board optic (MBO) type configurations is provided. The system board comprises a switch application specific integrated circuit (ASIC) assembly, a plurality of MBO interfaces comprising a plurality of via-in-pad plated over (VIPPO) vias, and a plurality of mounting holes. Each MBO interface is configured to mate with a soldered-down MBO assembly or a socket instance comprising a socketized MBO assembly. Each socketized MBO assembly comprises an interposer comprising a plurality of VIPPO vias, where the bottom contact pad of each VIPPO via is thicker than the top contact pad. Either configuration is facilitated without the need to modify the system board layout.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.