Systems, methods, and apparatus for soil and seed monitoring
US10681862B2 · kind B2 · utility
9Cited by
54References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 27, 2019 |
| Grant date | Jun 16, 2020 |
| Priority date | — |
| Expiry date | Feb 27, 2039 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA01C5/064
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Systems, methods and apparatus for monitoring soil properties and applying fertilizer during a planting operation. Various sensors are disposed in ground engaging components for monitoring soil properties. The ground engaging components may have structure for opening a side trench in the sidewalls of the seed trench and may include liquid application conduits for injecting liquid into the sidewalls of the resulting side trenches.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.