Epoxy mold making and micromilling for microfluidics
US10682789B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 28, 2015 |
| Grant date | Jun 16, 2020 |
| Priority date | — |
| Expiry date | Mar 18, 2037 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29K2907/00
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method for efficiently manufacturing and fabricating microfluidic chips, where a base mold is formed to have positive-relief features used to cast an intermediary template chip with negative-relief features having dimensions of a scale in the micron range. The intermediary template chip is used to case a production mold, which is formed of a reinforced epoxy resin that, once hardened into a solid epoxy member, can withstand the structural pressures of a CNC machining system. The production mold can be refined by a CNC machining, where the refined production mold is then used to cast production chips to be used as microfluidic chips.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.