High modulus spunbond
US10682795B2 · kind B2 · utility
0Cited by
2References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 20, 2017 |
| Grant date | Jun 16, 2020 |
| Priority date | — |
| Expiry date | Jul 20, 2038 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/726
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
The present invention is directed at a relatively high modulus spunbond nonwoven material that is suitable for use in relatively high deep draw molding applications.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.