Pressure sensor assembly having a cavity filled with gel or fluid
US10684184B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 23, 2017 |
| Grant date | Jun 16, 2020 |
| Priority date | — |
| Expiry date | Aug 23, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01L19/148
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A pressure sensor assembly having a printed circuit board (PCB) with a pressure sensor mounted on the PCB, a side wall engaging the PCB, a membrane, a cavity defined by the membrane, the side wall and the PCB, and a gel or liquid filling the cavity. The pressure sensor assembly may include a fill-hole extending into the cavity through which the cavity may be filled with the gel or liquid. The fill-hole may extend through one or both of the PCB and/or the side wall. The cavity is defined in part by a septum that allows a needle to pierce the septum for filling the cavity with the gel or liquid. A method of forming the pressure sensor assembly may include filling a cavity of the pressure sensor assembly with a gel or liquid through a fill-hole and curing the gel or liquid once in the cavity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.