Patent · US Active

Systems and methods of testing multiple dies

US10684322B2 · kind B2 · utility

0Cited by

9References

8Claims

0Family size

Assignee

TEXAS INSTRUMENTS INCORPORATED · US

Inventors

Rubin Ajit Parekhji · Bengaluru, IN
Mahesh M. Mehendale · Bengaluru, IN
Vinod Menezes · Bengaluru, IN
Vipul Kumar Singhal · Kanchinakote, IN

Key dates

Filing date	Jan 14, 2019
Grant date	Jun 16, 2020
Priority date	—
Expiry date	Jan 14, 2039

Classification

Technology area (CPC G)Physics
CPC primaryG01R31/318511
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

In a method of testing a semiconductor wafer including a scribe line and multiple dies, the method includes implementing a first landing pad on the scribe line, and implementing a first interconnect on the scribe line and between the first landing pad and a first cluster of the dies, thereby coupling the first landing pad to the first cluster of dies. The method also includes performing the testing of the first cluster of dies using automated test equipment (ATE) coupled to a probe tip by contacting the first landing pad with the probe tip, and applying an ATE resource to the first cluster of dies.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.