Chip packaging device and alignment bonding method thereof

US10685852B2 · kind B2 · utility

Assignee

• NATIONAL CHENG KUNG UNIVERSITY · TW

Inventors

• Po-Tsung Hsieh · Tainan, TW
• Chia-Ming Yang · Baoshan, TW
• In-Gann Chen · Tainan, TW
• Shih-Wen Tseng · Tainan, TW
• Ya-Wen Tsai
• Ya-Wen Chuang · Taoyuan, TW

Key dates

• Filing date: Nov 26, 2018
• Grant date: Jun 16, 2020
• Expiry date: Nov 26, 2038

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2224/8385
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A chip packaging device is provided, which includes a main body unit, packaging unit and an aligning unit. The main body unit includes a mounting base, holder and a rotational platform. The packaging unit includes upper and lower bonding elements, upper and lower chips and a mask; a vertical axis is at the middle of the upper and the lower bonding elements, and a horizontal axis is above the lower bonding element. The aligning unit includes an aligning detector and a first focusing detector. When the lower chip and the mask are disposed on the lower bonding element, place the liquid sample in the mask and spread a packaging adhesive over the surface thereof; then, remove the mask and use the aligning detector and the first focusing detector to detect the position of the lower chip respectively, such that the chips can be aligned and bonded with each other.