Quantum circuit assemblies with at least partially buried transmission lines and capacitors
US10686007B2 · kind B2 · utility
2Cited by
1References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 20, 2018 |
| Grant date | Jun 16, 2020 |
| Priority date | — |
| Expiry date | Jun 20, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03K19/195
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Embodiments of the present disclosure propose quantum circuit assemblies with transmission lines and/or capacitors that include layer-conductors oriented perpendicular to a substrate (i.e. oriented vertically) or a qubit die, with at least portions of the vertical layer-conductors being at least partially buried in the substrate. Such layer-conductors may form ground and signal planes of transmission lines or capacitor plates of capacitors of various quantum circuit assemblies.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.