Magnetic shielding package structure for MRAM device and method for producing the same
US10686008B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 11, 2019 |
| Grant date | Jun 16, 2020 |
| Priority date | — |
| Expiry date | Mar 11, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10159
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods of magnetically shielding an MRAM structure on all six sides in a thin wire or thin flip chip bonding package and the resulting devices are provided. Embodiments include forming a first metal layer embedded between an upper and a lower portion of a PCB substrate, the first metal layer having a pair of metal filled vias laterally separated; attaching a semiconductor die to the upper portion of the PCB substrate between the pair of metal filled vias; connecting the semiconductor die electrically to the PCB substrate through the pair of metal filled vias; removing a portion of the upper portion of the PCB substrate outside of the pair of metal filled vias down to the first metal layer; and forming a second metal layer over and on four opposing sides of the semiconductor die, the second metal layer landed on the first metal layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.