Patent · US Active

Laser component and method of producing a laser component

US10686295B2 · kind B2 · utility

0Cited by

4References

16Claims

0Family size

Assignee

OSRAM Opto Semiconductors GmbH · DE

Inventors

Jens Mueller · Stuttgart, DE
Markus Horn · Straubing, DE

Key dates

Filing date	Aug 14, 2014
Grant date	Jun 16, 2020
Priority date	—
Expiry date	Mar 22, 2035

Classification

Technology area (CPC H)Electricity
CPC primaryH01S2301/176
WIPO fieldOptics
WIPO sectorInstruments

Abstract

A laser component includes an edge-emitting first laser chip with an upper side, a lower side, an end side and a side surface, wherein an emission region is arranged on the end side, the side surface is oriented perpendicularly to the upper side and to the end side, a first metallization is arranged on the upper side, a step by which a part adjacent to the upper side of the side surface is set back, is formed on the side surface, a passivation layer is arranged in the set-back part of the side surface, the laser chip is arranged on a carrier, the side surface faces toward a surface of the carrier, and a first solder contact arranged on the surface of the carrier electrically conductively connects to the first metallization.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.