Method for optical interconnection between semiconductor chips using mid-infrared
US10686534B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 5, 2019 |
| Grant date | Jun 16, 2020 |
| Priority date | — |
| Expiry date | Apr 5, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2225/06534
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A method for optical interconnection between semiconductor chips according to an embodiment include converting an electrical signal to an optical signal, transmitting the optical signal to a second substrate disposed above or below a first substrate using an optical transmitter provided on the first substrate, receiving the optical signal using an optical detector provided on the second substrate, and converting the received optical signal to an electrical signal. Accordingly, using a mid-infrared wavelength range of light that is transparent to semiconductor materials such as silicon and next-generation high-mobility materials, it is possible to enable interconnection between stacked semiconductor chips without using metal wiring. Using optical interconnection, it is possible to significantly reduce the bandwidth and power consumption, and overcome the limitations of TSV technology, and it is possible to extend the photonics technology and platform established in the existing Si Photonics, thereby reducing the cost required for design.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.