Patent · US Active

Substrate analysis nozzle and method for analyzing substrate

US10688485B2 · kind B2 · utility

1Cited by
3References
2Claims
0Family size

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Key dates

Filing dateJul 18, 2017
Grant dateJun 23, 2020
Priority date
Expiry dateFeb 10, 2038

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L21/6715
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

The present invention provides a substrate analysis nozzle that reliably prevents a leakage (release) of analysis solution from the nozzle even in the case of a highly hydrophilic substrate and that collects the analysis solution with a high collection ratio after scanning. The present invention is directed to a substrate analysis nozzle configured to discharge an analysis solution from a tip of the substrate analysis nozzle onto a substrate, configured to scan a surface of the substrate using the discharged analysis solution, and configured to suck the analysis solution. The substrate analysis nozzle has a triple-tube structure made up of: a pipe through which the analysis solution is discharged and sucked; a first outer tube surrounding the pipe and surrounding the analysis solution used for scanning; and a second outer tube surrounding the first outer tube. The substrate analysis nozzle includes: first exhausting means including an exhaust path defined between the pipe and the first outer tube; and second exhausting means including an exhaust path defined between the first outer tube and the second outer tube.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.