Method for controlling a device system during the cutting of a workpiece along a cutting line
US10688574B2 · kind B2 · utility
0Cited by
19References
8Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 11, 2014 |
| Grant date | Jun 23, 2020 |
| Priority date | — |
| Expiry date | Feb 11, 2034 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB28D7/005
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method for controlling a device system (10) during the cutting of a workpiece (18) along a cutting line (43) up to a first end point (E1) using a saw head (12) that can be moved on a guide rail (11) along an advancing direction (26), whereby the saw head (12) is arranged on the guide rail (11) in a starting position (X0), and a first partial length (L1) extending from the starting position (X0) to the first end point (E1) of the cutting line (43) is entered.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.