Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines
US10688599B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 18, 2018 |
| Grant date | Jun 23, 2020 |
| Priority date | — |
| Expiry date | Dec 31, 2038 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/54
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method for laser processing a transparent workpiece includes forming a contour line having defects in the transparent workpiece, which includes directing a pulsed laser beam oriented along a beam pathway through a beam converting element and through a phase modifying optical element such that the portion of the pulsed laser beam directed into the transparent workpiece includes a phase shifted focal line having a cross-sectional phase contour that includes phase contour ridges induced by the phase modifying optical element and extending along phase ridge lines. Moreover, the phase shifted focal line generates an induced absorption within the transparent workpiece to produce a defect within the transparent workpiece including a central defect region and a radial arm that extends outward from the central defect region in a radial defect direction oriented within 20° of the phase ridge lines of the phase shifted focal line.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.