Foldable electronic device assemblies and cover elements for the same
US10688756B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 13, 2017 |
| Grant date | Jun 23, 2020 |
| Priority date | — |
| Expiry date | Jan 13, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/266
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A cover element for a foldable electronic device that includes a foldable glass element, first and second primary surfaces, and a compressive stress region extending from the first primary surface to a first depth that is defined by a stress σI of at least about 100 MPa in compression at the first primary surface. The device also includes a polymeric layer disposed over the first primary surface. The glass element has a stress profile such that when the glass element is bent to a target bend radius of from 1 mm to 20 mm, to induce a bending stress σB at the first primary surface in tension, σI+σB<400 MPa (in tension). Further, the cover element can withstand a pen drop height of at least 1.5 times that of a control pen drop height of the cover element without the layer according to a Drop Test 1.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.