Card substrate laminating device
US10688764B2 · kind B2 · utility
1Cited by
40References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 2, 2015 |
| Grant date | Jun 23, 2020 |
| Priority date | — |
| Expiry date | Oct 2, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1744
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A card substrate laminating device includes a transfer ribbon and a transfer roller. The transfer ribbon includes a carrier layer and a transfer layer attached to the carrier layer. The transfer roller is configured to heat and transfer a portion of the transfer layer from the carrier layer to a surface of a card substrate. The transfer roller has a circumference that is less than one-half of a length of the card substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.