Multiple resin over-mold for printed circuit board electronics and light guide
US10688916B2 · kind B2 · utility
0Cited by
1References
27Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 10, 2018 |
| Grant date | Jun 23, 2020 |
| Priority date | — |
| Expiry date | May 22, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1316
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A laminated light guide and component carrier includes a polymeric material body having a first face. A light emitting diode is positioned on the first face. A connector is positioned on the first face. A through aperture is created in the body positioned proximate to the light emitting diode. A light guide of a light transmissive polymeric material is overmolded onto the first face proximate to and covering the light emitting diode and filling the through aperture, and omitted from the space envelope containing the connector. An opaque polymeric material coating layer is affixed onto the first face outside of the light guide.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.