High-forming multi-layer aluminum alloy package
US10689041B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 7, 2016 |
| Grant date | Jun 23, 2020 |
| Priority date | — |
| Expiry date | Oct 7, 2036 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC22F1/047
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
Provided herein are novel, high-forming multi-layer aluminum alloy packages that include a core layer and one or more cladding layers. The alloy packages have excellent bake-hardening properties and are highly recyclable. The packages also display exceptional bendability and elongation properties. Also provided herein are novel aluminum alloy compositions for use as cladding layers. The compositions contain up to 0.6 wt. % Fe and one or more of Mn, Ni, Ti, Co, Nb, Cr, V, Zr, Hf and Ta.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.