Separation of glass shapes using engineered induced thermal gradients after process cutting
US10689286B2 · kind B2 · utility
0Cited by
7References
18Claims
0Family size
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Key dates
| Filing date | Jan 10, 2018 |
| Grant date | Jun 23, 2020 |
| Priority date | — |
| Expiry date | Nov 11, 2038 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC03B33/04
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method includes cutting an outer diameter into a glass substrate. An inner diameter within the outer diameter is also cut into the glass substrate. A first region inside the outer diameter and a second region inside the inner diameter are heated. The second region inside the inner diameter is cooled, wherein the cooling causes the second region to detach from the first region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.