Resin composition, prepreg, metal foil-clad laminate, resin sheet and printed circuit board
US10689496B2 · kind B2 · utility
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12Claims
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Key dates
| Filing date | Aug 23, 2017 |
| Grant date | Jun 23, 2020 |
| Priority date | — |
| Expiry date | Aug 23, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0248
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The resin composition according to the present invention is a resin composition including a cyanate compound (A) and/or a maleimide compound (B), and an inorganic filler (C), wherein the inorganic filler (C) includes a boron nitride particle aggregate including primary hexagonal boron nitride particles, wherein (0001) planes of the primary hexagonal boron nitride particles are stacked on top of each other to thereby form the boron nitride particle aggregate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.