Thermally conductive adhesive

US10689551B2 · kind B2 · utility

Assignee

• Henkel AG & Co. KGaA · DE

Inventors

• Ruediger Butterbach · Essen, DE
• Patrick MARKIEFKA · Goldkronach, DE
• Carsten Schubert · Goldkronach, DE
• Judith Siepenkothen · Ratingen, DE
• Siegfried Kopannia · Goldkronach, DE

Key dates

• Filing date: Sep 5, 2017
• Grant date: Jun 23, 2020
• Expiry date: Oct 27, 2037

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C09K5/14
• WIPO field: Basic materials chemistry
• WIPO sector: Chemistry

Abstract

The present invention relates to hotmelt adhesives with improved thermal conductivity, uses thereof and methods for the manufacture of articles with improved thermal conductivity using said adhesive compositions. The adhesive compositions of the invention comprise at least one (co)polymer binder and combination of different fillers, as defined herein.