Heat dissipating frame structure and fabricating method thereof
US10690333B2 · kind B2 · utility
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4References
6Claims
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Assignee
Inventor
Key dates
| Filing date | Jul 13, 2016 |
| Grant date | Jun 23, 2020 |
| Priority date | — |
| Expiry date | Nov 8, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8506
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Disclosed are a heat dissipating frame structure having higher heat dissipation efficiency than the prior arts and a fabricating method thereof. Namely, the heat dissipating frame structure comprises a metal plate assembly, a part of which contacting with a heating element, and a plastic composition combined with the metal plate assembly to through the metal plate assembly receive the heat generated from the heating element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.