Systems and methods for improved waste gas abatement
US10690341B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 4, 2018 |
| Grant date | Jun 23, 2020 |
| Priority date | — |
| Expiry date | Aug 20, 2038 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P30/00
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
The present disclosure generally relates to systems and methods for the combustive abatement of waste gas formed during the manufacture of semiconductor wafers. In particular, the systems described herein are capable of combusting air-polluting perfluorocarbons, including those having high greenhouse gas indexes such as hexafluoroethane (C2F6) and tetrafluoromethane (CF4), as well as particulate-forming silicon dioxide precursors, such as silane (SiH4) and tetraethoxysilane (Si(OC2H5)4, abbreviated TEOS), with greater efficiency and lower energy usage than prior abatement systems. More particularly, and in one preferred embodiment, the present disclosure is directed to a waste gas abatement system that utilizes a combination of non-combustible and combustible gases (or gas mixtures) for thermal combustion, which are directed through multiple permeable interior surfaces of a reaction chamber, efficiently combusting waste gas and preventing undesirable accumulation of solid particulate matter on the chamber surfaces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.