Metrology technique that provides true flattening
US10690697B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 26, 2018 |
| Grant date | Jun 23, 2020 |
| Priority date | — |
| Expiry date | Oct 26, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30164
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An apparatus and method for topographically characterizing a workpiece. The method includes scanning a first surface of a workpiece with a scanning probe at a first resolution to derive a first topographical image, and performing a refining operation on the first topographical image to obtain a true first topographical image. The method also includes scanning, with the scanning probe, a surface of interest of the workpiece, which is a sub-portion of the first surface, at a second resolution that is higher than the first resolution to derive a second topographical image. The second topographical image is scaled down to the first resolution. The method further includes performing a pattern recognition operation to substantially match the scaled-down second topographical image to a corresponding sub-portion of the true first topographical image. The matched sub-portion of the true first topographical image is employed to refine the second topographical image.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.