Thermal protection for modular components in a network device

US10690868B1 · kind B1 · utility

Assignee

• Cisco Technology, Inc. · US

Inventors

• Joel Richard Goergen · Soulsbyville, US
• Mehmet Onder Cap · Sunnyvale, US
• Arjun Jayaprakash · Savanuru, IN
• Damaruganath Pinjala · Kanchinakote, IN
• Marc Mantelli · Gardanne, FR
• Umeshbabu NANDANAN · San Jose, US
• Jatin Kohli · Bengaluru, IN
• Rohit Dev Gupta · Bengaluru, IN

Key dates

• Filing date: Oct 8, 2018
• Grant date: Jun 23, 2020
• Expiry date: Oct 8, 2038

Classification

• Technology area (CPC G): Physics
• CPC primary: G02B6/4268
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

In one embodiment, an apparatus includes an optical module comprising a first end for insertion into a network device and a second end extending from the network device when the optical module is inserted into the network device, and a thermal protective layer extending over a portion of the second end of the optical module, the thermal protective layer preventing direct contact with an external surface of the optical module during removal of the optical module from the network device. The thermal protective layer exposes a portion of the external surface of the second end of the optical module to allow heat to be released from the external surface of the optical module.