Process for analyzing printed circuit board and packaging manufacturing design rules
US10691868B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 10, 2018 |
| Grant date | Jun 23, 2020 |
| Priority date | — |
| Expiry date | Sep 10, 2038 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P90/02
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
The present disclosure relates to a system and method for use in an electronic circuit design. Embodiments may include an electronic computer aided design (“CAD”) system configured to receive one or more design rules and to receive one or more manufacturing rules. The CAD system may be further configured to analyze design database objects from the electronic design with respect to the manufacturing rules. The CAD system may generate a manufacturing output file, based upon, at least in part, the analyzing. Embodiments may also include a signoff computer aided manufacturing (“CAM”) station configured to receive the manufacturing output file. The CAM station may be configured to attempt to validate the manufacturing output file.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.