Back chamber volume enlargement microphone package
US10694297B1 · kind B1 · utility
1Cited by
1References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 25, 2019 |
| Grant date | Jun 23, 2020 |
| Priority date | — |
| Expiry date | Mar 25, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2201/003
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A MEMS microphone package includes a substrate, a transducer, an integrated circuit chip, and a housing. The substrate has a hollow chamber, a first opening and a second opening, wherein the first opening and the second opening communicate with the hollow chamber. The transducer is disposed on the substrate. The integrated circuit chip is disposed on the substrate. The housing is disposed on the substrate, and covers the integrated circuit chip and the transducer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.