Base station antenna assembly having feed board therein with reduced passive intermodulation (PIM) distortion
US10694397B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 18, 2018 |
| Grant date | Jun 23, 2020 |
| Priority date | — |
| Expiry date | Oct 18, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04B7/0408
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
An antenna assembly includes a substrate having front and back surfaces thereon and a plurality of through-holes therein, along with a solder pad on the back surface of the substrate. An input cable is also provided, which is attached to the back surface of the substrate. The input cable includes an outer conductor, which contacts the back surface of the substrate, and an inner conductor, which extends at least partially through a first of the plurality of through-holes and is electrically connected to the solder pad. A metal trace (e.g., 50-ohm trace) is provided on the front surface of the substrate. The metal trace is electrically connected to the solder pad by electrically conductive plating in a second of the plurality of through-holes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.