Plastic injection molded potting cups and related methods
US10694617B2 · kind B2 · utility
0Cited by
8References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 31, 2018 |
| Grant date | Jun 23, 2020 |
| Priority date | — |
| Expiry date | Jul 31, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1327
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A potting cup is provided and is positioned on a printed circuit board. The potting cup encapsulates a portion of the printed circuit board including at least one interface subject to corrosion when exposed to moisture and is configured to receive a potting material in the encapsulated portion to cover the at least one interface subject to corrosion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.