Method of seamless bonding and device therefor
US10695854B2 · kind B2 · utility
0Cited by
3References
16Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 27, 2015 |
| Grant date | Jun 30, 2020 |
| Priority date | — |
| Expiry date | Aug 7, 2035 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2101/32
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of seamless bonding comprises in sequence: feeding a filler wire into a de-scaling unit; removing with the de-scaling unit a contamination layer disposed onto a core of the filler wire, removing the contamination layer comprising: applying a laser beam to the filler wire at a wavelength causing at least a portion of the contamination layer to break away from the core of the filler wire while leaving the core unaffected; and feeding the filler wire to a seamless bonding unit. A seamless bonding device is also presented.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.