Patent · US Active

Bonding method using a carbon nanotube structure

US10696032B2 · kind B2 · utility

1Cited by
1References
20Claims
0Family size

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Key dates

Filing dateAug 31, 2018
Grant dateJun 30, 2020
Priority date
Expiry dateDec 19, 2038

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC09J2400/10
  • WIPO fieldOther special machines
  • WIPO sectorMechanical engineering

Abstract

A bonding method utilizing carbon nanotubes provides first and second objects to be bonded and a carbon nanotube structure. The carbon nanotube structure comprises a super-aligned carbon nanotube film comprising carbon nanotubes, the carbon nanotubes extending substantially along a same direction. The carbon nanotube structure is laid on surface of first object and surface of second object is pressed onto the carbon nanotube structure. Pressure being applied to the first object and the second object bonds the two together.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.