Molecularly engineered high thermal conductivity polymers and methods for making the same
US10696885B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 7, 2018 |
| Grant date | Jun 30, 2020 |
| Priority date | — |
| Expiry date | Jun 7, 2038 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K2201/001
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Methods of increasing thermal conductivity of a bulk polymer are provided. The methods include contacting a bulk polyelectrolyte polymer comprising an ionizable repeating pendant group with an aqueous liquid having a pH that ionizes the pendant group and isotropically extend the polyelectrolyte polymer to an extended non-globular chain conformation. The polyelectrolyte polymer so treated thus exhibits a thermal conductivity of greater than or equal to about 0.6 W/m·K and optionally greater than or equal to about 1 W/m·K. In other aspects, the present disclosure provides a high thermal conductivity material comprising a bulk polyelectrolyte polymer bearing a repeating charged group and having an extended non-globular chain conformation and that exhibits a thermal conductivity of greater than or equal to about 0.6 W/m·K and optionally greater than or equal to about 1 W/m·K. The high thermal conductivity material may be used in electronic devices, including as housings/encapsulation and thermal interfaces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.