Methods of forming rotary sputtering target
US10697056B2 · kind B2 · utility
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34Claims
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Key dates
| Filing date | Mar 17, 2016 |
| Grant date | Jun 30, 2020 |
| Priority date | — |
| Expiry date | Mar 9, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E60/10
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Disclosed is a method for producing rotary sputtering target assemblies that are bonded to a suitable backing support. The bonding between the sputtering target body and the backing support is achieved by controlled heating under a suitable temperature, preferably with the help of conductive layer between the induction heater and internal target body that is inductively heated in a manner that enhances axial and radial gradient heating. A non-adhesive protective wrap can also be placed at the target body such as between the conductive wrap and target body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.