Illumination apparatus having thermally isolated heat sinks and dual light sources
US10697625B1 · kind B1 · utility
Inventors
Key dates
| Filing date | Oct 27, 2019 |
| Grant date | Jun 30, 2020 |
| Priority date | — |
| Expiry date | Oct 27, 2039 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An apparatus includes a light emitting diode (LED) chip; a laser light source; a front heat sink including first and second holes; a lens arranged to extend over the first hole; a back heat sink; and an insulating circuit board including a third hole, the circuit board sandwiched between the heat sinks such that the second hole and the third holes are aligned. The LED chip is mounted in a surface of the circuit board facing the front heat sink, and arranged such that it aligns with the first hole and the lens. The laser light source is provided in the back heat sink and arranged such that it extends at least partially through the second and third holes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.