Thin film capacitor and multilayer circuit board having the thin film capacitor embedded therein
US10699844B1 · kind B1 · utility
1Cited by
0References
5Claims
0Family size
Assignee
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Key dates
| Filing date | Jan 6, 2020 |
| Grant date | Jun 30, 2020 |
| Priority date | — |
| Expiry date | Jan 6, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10015
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed herein is a thin film capacitor that includes a lower electrode layer, an upper electrode layer, and a dielectric layer positioned between the lower electrode layer and the upper electrode layer. The upper electrode layer has a first capacitive electrode part opposed to the lower electrode layer through the dielectric layer without being connected to the lower electrode layer and a fiducial mark part penetrating the dielectric layer to be connected to the lower electrode layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.