Patent · US Active

Reverse mounted gull wing electronic package

US10699992B2 · kind B2 · utility

0Cited by

3References

12Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Juan Landeros · Gilbert, US
Jason M. Seitz · San Francisco, US
Mingjing Huang · San Francisco, US

Key dates

Filing date	Dec 23, 2015
Grant date	Jun 30, 2020
Priority date	—
Expiry date	Jan 9, 2036

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2201/10757
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

An electronic assembly that includes a substrate having an aperture which extends through the substrate. The electronic assembly further includes a gull wing electronic package that includes leads which are solder mounted to the substrate such that the gull wing electronic package is within the aperture in the substrate, wherein the aperture is concentric with an exterior of the gull wing electronic package.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.