Solid-state imaging element, method for manufacturing the same, and electronic apparatus
US10700114B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 11, 2017 |
| Grant date | Jun 30, 2020 |
| Priority date | — |
| Expiry date | Apr 11, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/811
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present technology relates to a solid-state imaging element configured so that pixels can be more reliably separated, a method for manufacturing the solid-state imaging element, and an electronic apparatus. The solid-state imaging element includes a photoelectric converter, a first separator, and a second separator. The photoelectric converter is configured to perform photoelectric conversion of incident light. The first separator configured to separate the photoelectric converter is formed in a first trench formed from a first surface side. The second separator configured to separate the photoelectric converter is formed in a second trench formed from a second surface side facing a first surface. The present technology is applicable to an individual imaging element mounted on, e.g., a camera and configured to acquire an image of an object.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.