COB bonding laser diode interface mating device
US10700488B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 16, 2016 |
| Grant date | Jun 30, 2020 |
| Priority date | — |
| Expiry date | Dec 16, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/183
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A COB bonding laser diode interface mating device comprises a laser diode and a driver integrated circuit (2). The laser diode includes a light-emitting chip (11). The light-emitting chip (11) is a bare die directly bonded to a circuit board. The driver integrated circuit (2) is a driver chip that is a packaged chip. The light-emitting chip (11) and the driver chip are connected through a capacitor-resistor network (3). The capacitor-resistor network (3) allows the driver integrated circuit (2) to provide a bias current and a modulation current to the laser diode such that the laser diode is in an activated state. The capacitor-resistor network (3) realizes interface mating between the COB bonding laser diode and the driver integrated circuit (2), thereby solving a problem that the interface mating cannot be easily achieved, reducing costs, and improving production efficiency.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.