Heat dissipation assembly and action camera
US10701249B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 14, 2019 |
| Grant date | Jun 30, 2020 |
| Priority date | — |
| Expiry date | Aug 14, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04N23/55
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An action camera includes an external housing and a main chip disposed inside the external housing. The action camera also includes a heat dissipation assembly configured to dissipate heat from at least one heat generating component of the action camera. The at least one heat generating component includes the main chip. The heat dissipation assembly includes a heat tube and a first heat dissipation panel. An evaporation end and a condensation end of the heat tube are both in thermal contact with the first heat dissipation panel. The condensation end of the heat tube is disposed farther away from the main chip relative to the evaporation end of the heat tube. The first heat dissipation panel is configured to be in thermal contact with the main chip and the external housing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.