Thermal camera with image enhancement derived from microelectromechanical sensor
US10701296B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 18, 2018 |
| Grant date | Jun 30, 2020 |
| Priority date | — |
| Expiry date | Oct 18, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01J2005/0077
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A camera system and methods of enhancing images using direct measurement of angular displacement are disclosed. The camera system includes an optical element, a focal plane array (FPA), a motion sensor and a processor. The FPA has pixels sensing image pixel data from the optical element. The pixels have an angular resolution dependent upon a configuration of the optical element and a dimension of the pixels. The pixels detect electromagnetic waves having a wavelength within a range from 800 nanometers to 20 micrometers. The motion sensor senses angular displacement in 3D. The processor receives the image pixel data generated at distinct first instants of time during an image capture period from the FPA and motion reading(s) during the image capture period, converts the motion readings into angular displacement of the FPA, and selects an image processing algorithm to generate at least one image enhancement for the image pixel data.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.