3D multi-aperture imaging device
US10701340B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 23, 2018 |
| Grant date | Jun 30, 2020 |
| Priority date | — |
| Expiry date | Feb 23, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04N23/951
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A 3D multi-aperture imaging device that is, on the one hand, able to provide 3D information on a scene and, on the other hand, allows obtaining high lateral resolution and/or a wide total field of view, is described. The 3 D multi-aperture imaging device is provided with a first plurality of optical channels for projecting overlapping first partial fields of view of a total field of view on first image sensor areas of an image sensor of the 3D multi-aperture imaging device, as well as with a second plurality of optical channels for projecting overlapping second partial fields of view of the total field of view on second image sensor areas of the image sensor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.