Enclosure for electronic components
US10701823B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 25, 2019 |
| Grant date | Jun 30, 2020 |
| Priority date | — |
| Expiry date | Feb 25, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H2001/0021
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An enclosure for electronics includes a base, a base cover, a gasket, and an enclosure cover. The base receives one or more electronic elements. The base cover is mounted over the first base to secure the electronic elements within the base and form a unit having a groove in at least a part of the periphery of the unit. The gasket resides within the groove of the first unit. The enclosure cover is mounted over the first unit and the gasket and applies a compressive force to the gasket such that the gasket (i) forms a seal for the enclosure and (ii) applies force that secures at least a part of the periphery of the first base cover to at least a part of the periphery of the first base. In a single-unit assembly, the enclosure cover is an assembly cover that attaches to the unit. In a dual-unit assembly, each unit functions as the enclosure cover for the other unit in a clam-shell configuration.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.