Mounting apparatus, for mounting at least one heat dissipating electrical device, optionally including a heat sink body for solid, gas and fluid heat exchange, and circuit board assembly providing interface between circuits
US10701841B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 30, 2015 |
| Grant date | Jun 30, 2020 |
| Priority date | — |
| Expiry date | Oct 31, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH02K2211/03
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention in part, is a heat removal system or apparatus providing a method of mounting and electrically connecting heat dissipating electrical devices, preferably in a radial geometry while achieving good surface-to-surface clamping force, in liquid and or air cooled variants. A variation of the invention can provide arc safety for high power density applications. In specific embodiments, the invention also provides low inductance as a result of minimal loop area while also providing high voltage isolation between devices. The N-sided geometry and effective clamping methodology offer low mass and volume. A variation of the invention also provides a signal interface for driving power electronics devices. A unique cylindrical electrical device package with terminals can support capacitor, inductor and transformer integration in a common package. The various elements of the invention can be combined together to minimize size and weight, while addressing high voltage, noise and thermal management.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.