Shield assembly for an electronic component
US10701845B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 30, 2019 |
| Grant date | Jun 30, 2020 |
| Priority date | — |
| Expiry date | Jan 30, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04M1/0264
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A shield assembly can enclose an electronic component in a chamber of a mobile communication device. The shield assembly can include a chassis having a slot and a conductive rail adjacent to the slot. A covering can be mounted over the electronic component and coupled to the chassis via a spring contact disposed in the slot. The covering can include a shield element configured to cover a chamber enclosing the electronic component. The covering can further include a first tab connected to the shield element, and a second tab connected to the shield element and spaced apart from the first tab by a gap. A spring contact can be disposed in the gap and electrically connected to the shield element via at least one of the first tab and the second tab.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.